Patent · US Active

Robust mold integrated substrate

US12327801B2 · kind B2 · utility

0Cited by

0References

20Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Jimin Yao · Chandler, US
Kyle Yazzie · San Tan Valley, US
Shawna M. Liff · Scottsdale, US

Key dates

Filing date	Feb 10, 2022
Grant date	Jun 10, 2025
Priority date	—
Expiry date	Dec 23, 2043

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2223/54426
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An apparatus, comprising an Integrated Circuit (IC) package comprising a dielectric, the IC package has a first surface and an opposing second-surface, wherein the first surface is separated from the second surface by a thickness of the IC package, wherein sidewalls extend along a perimeter and through the thickness between the first surface and the second surface, and a structure comprising a frame that extends at least partially along the perimeter of the IC package, wherein the structure extends at least through the thickness of the IC package and inwardly from the sidewalls of the IC package.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.