Semiconductor package
US12327826B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 15, 2022 |
| Grant date | Jun 10, 2025 |
| Priority date | — |
| Expiry date | May 5, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16157
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package includes an antenna structure including an antenna member configured to transmit and receive a signal through the first surface in the dielectric layer, a connection via extending from the antenna member toward the second surface, and a ground member spaced apart from the connection via; a frame surrounding the side surface of the antenna structure; a first encapsulant covering at least a portion of the antenna structure and the frame; a redistribution structure on the second surface and including an insulating layer in contact with the antenna structure and the frame, and a redistribution conductor configured to be electrically connected to the ground member and the connection via in the insulating layer; a first semiconductor chip on the redistribution structure and electrically connected to the antenna member through the redistribution conductor; a second encapsulant encapsulating the first semiconductor chip on the redistribution structure; and a shielding layer surrounding a surface of the second encapsulant.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.