Method of using processing oven
US12330228B2 · kind B2 · utility
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10References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 6, 2023 |
| Grant date | Jun 17, 2025 |
| Priority date | — |
| Expiry date | Nov 6, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/94
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of using a processing oven may include disposing at least one substrate in a chamber of the oven and activating a lamp assembly disposed above them to increase their temperature to a first temperature. A chemical vapor may be admitted into the chamber above the at least one substrate and an inert gas may be admitted into the chamber below the at least one substrate. The temperature of the at least one substrate may then be increased to a second temperature higher than the first temperature and then cooled down.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.