Plating apparatus and plating method
US12331420B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2022 |
| Grant date | Jun 17, 2025 |
| Priority date | — |
| Expiry date | Jan 31, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/12
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A specific portion of a substrate is allowed to be shielded at a desired timing, and making a plating film-thickness uniform is improved.A plating module includes: a plating tank 410 for housing a plating solution; an anode 430 disposed in the plating tank 410; a substrate holder 440 for holding a substrate Wf with a surface to be plated Wf-a facing downward; a rotation mechanism 447 configured to rotate the substrate holder 440 in a first direction and a second direction opposite to the first direction; and a shielding mechanism 485 configured to move a shielding member 481 into between the anode 430 and the substrate Wf depending on a rotation angle of the substrate holder 440.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.