Methods and apparatus to reduce stress on lasers in optical transceivers
US12332477B2 · kind B2 · utility
0Cited by
3References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2021 |
| Grant date | Jun 17, 2025 |
| Priority date | — |
| Expiry date | Oct 19, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4201
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus to reduce stress on lasers in optical transceivers are disclosed. An apparatus comprising a printed circuit board (PCB) having a first side and a second side opposite the first side; and a first stiffener attached to the first side of the PCB; and a photonic integrated circuit (PIC) attached to the first stiffener. The first stiffener is between the PIC and the PCB. The apparatus also includes a second stiffener attached to the second side of the PCB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.