Resist underlayer film-forming composition
US12332566B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2019 |
| Grant date | Jun 17, 2025 |
| Priority date | — |
| Expiry date | Jul 18, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09D163/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A resist underlayer film-forming composition including: a resin having a repeating structural unit including at least one —C(═O)—O— group in a main chain and a repeating structural unit including at least one hydroxy group in a side chain, or including at least one —C(═O)—O— group in a main chain and at least one hydroxy group in a side chain, wherein none of these units have an organic group containing an epoxy or oxetane ring; an acid catalyst or salt thereof in an amount of 0.1 to 10 parts by mass relative to 100 parts by mass of the resin, when the catalyst is a monovalent acid, an acid dissociation constant pKa is −0.5 or less in 25° C. water, or when a multivalent acid, an acid dissociation constant pKa1 is −0.5 or less in 25° C. water; and a solvent, wherein the composition does not include a monomer crosslinking agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.