Substrate treating apparatus
US12334330B2 · kind B2 · utility
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3References
19Claims
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Assignee
Inventors
Key dates
| Filing date | Jul 8, 2021 |
| Grant date | Jun 17, 2025 |
| Priority date | — |
| Expiry date | Oct 26, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6719
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for treating a substrate using a treating fluid in a supercritical state is provided. In a pressure increasing step of increasing a pressure in the treating space from a pressure lower than a critical pressure of the treating fluid to a treating pressure higher than the critical pressure, the apparatus controls a supply amount of the treating fluid supplied from a first supply port to control flow of the treating fluid supplied from the first supply port and then exhausted through an exhaust port.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.