Apparatus and method for treating substrate
US12334386B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 28, 2021 |
| Grant date | Jun 17, 2025 |
| Priority date | — |
| Expiry date | May 9, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for treating a substrate includes a transfer part, a first transfer robot and a second transfer robot disposed in a longitudinal direction of the transfer part, a liquid treating part disposed at one side of the transfer part to apply a liquid onto the substrate by supplying the liquid to the substrate, and a heat treating part disposed at an opposite side of the transfer part to face a first process treating part, to perform heat-treatment with respect to the substrate. The heat treating part includes a cooling transfer module to transfer the substrate between the first transfer robot and the second transfer robot and to cool the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.