Metal interconnect structure having serpent metal line
US12334436B2 · kind B2 · utility
0Cited by
2References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 10, 2021 |
| Grant date | Jun 17, 2025 |
| Priority date | — |
| Expiry date | Mar 23, 2042 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/32
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a first metal interconnection disposed on a substrate, a second metal interconnection disposed on the first metal interconnection, a first contact via disposed between the first metal interconnection and the second metal interconnection, a first serpent metal line connecting to a first end of the first metal interconnection, and a second serpent metal line connecting to a second end of the first metal interconnection. Preferably, the first serpent metal line, the second serpent metal line, and the first metal interconnection are on a same level.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.