Soldered metallic reservoirs for enhanced transient and steady-state thermal performance

US12334453B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Nicholas Neal · Gilbert, US
• Nicholas S. Haehn · Scottsdale, US
• Sergio Antonio Chan Arguedas · Chandler, US
• Edvin Cetegen · Chandler, US
• Jacob VEHONSKY · Gilbert, US
• Steve Cho · Chandler, US
• Rahul Jain · Chandler, US
• Antariksh Rao Pratap SINGH · Gilbert, US
• Tarek A. Ibrahim · Mesa, US
• Thomas HEATON · Mesa, US

Key dates

• Filing date: Jun 29, 2023
• Grant date: Jun 17, 2025
• Expiry date: Jun 29, 2043

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/16251
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Embodiments disclosed herein include electronic packages with thermal solutions. In an embodiment, an electronic package comprises a package substrate, a first die electrically coupled to the package substrate, and an integrated heat spreader (IHS) that is thermally coupled to a surface of the first die. In an embodiment, the IHS comprises a main body having an outer perimeter, and one or more legs attached to the outer perimeter of the main body, wherein the one or more legs are supported by the package substrate. In an embodiment, the electronic package further comprises a thermal block between the package substrate and the main body of the IHS, wherein the thermal block is within the outer perimeter of the main body.