Semiconductor package with integrated capacitors
US12334455B2 · kind B2 · utility
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2References
13Claims
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Key dates
| Filing date | Jul 15, 2024 |
| Grant date | Jun 17, 2025 |
| Priority date | — |
| Expiry date | Jul 15, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16235
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In one aspect, a capacitor or network of capacitors is/are provided for vertical power delivery in a package where the capacitor(s) is/are embedded in or forms the entirety of the package substrate core. In a second aspect, a plurality of thin-film capacitor structures are provided for implementing vertical power delivery in a package. In a third aspect a method is provided for fabricating hermetically sealed thin-film capacitors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.