Michael Alfano
7Patents
2h-index
14Co-inventors
44Inventor score
Filing activity: Mar 30, 2012 → Jul 15, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9806014B2 | Interposer with beyond reticle field conductor pads | Electricity | 6 | Active |
| US8704353B2 | Thermal management of stacked semiconductor chips with electrically non-functional interconnects | Electricity | 4 | Active |
| US9793239B2 | Semiconductor workpiece with selective backside metallization | Electricity | 1 | Active |
| US11830817B2 | Creating interconnects between dies using a cross-over die and through-die vias | Electricity | 1 | Active |
| US10290606B2 | Interposer with identification system | Electricity | 0 | Active |
| US12334455B2 | Semiconductor package with integrated capacitors | Electricity | 0 | Active |
| US12288756B2 | Semiconductor package with integrated capacitors | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.