Encapsulated package including device dies connected via interconnect die
US12334464B2 · kind B2 · utility
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11References
20Claims
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Key dates
| Filing date | Apr 8, 2024 |
| Grant date | Jun 17, 2025 |
| Priority date | — |
| Expiry date | Apr 8, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19104
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method includes bonding a first device die and a second device die to an interconnect die. The interconnect die includes a first portion over and bonded to the first device die, and a second portion over and bonded to the second device die. The interconnect die electrically connects the first device die to the second device die. The method further includes encapsulating the interconnect die in an encapsulating material, and forming a plurality of redistribution lines over the interconnect die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.