Inventor · Baoshan, TW

Tu-Hao Yu

23Patents
5h-index
26Co-inventors
69Inventor score

Filing activity: Aug 11, 2000 → Apr 8, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US7670869B2 Semiconductor device and fabrications thereof Electricity 14 Active
US6906377B2 Flash memory cell and fabrication thereof Electricity 9 Expired
US10720401B2 Interconnect chips Electricity 8 Active
US10304800B2 Packaging with substrates connected by conductive bumps Electricity 8 Active
US7138654B2 Chemical-mechanical polishing proximity correction method and correction pattern thereof Electricity 7 Expired
US10867954B2 Interconnect chips Electricity 5 Active
US10510722B2 Semiconductor device and method for manufacturing the same Electricity 4 Active
US10170457B2 COWOS structures and method of forming the same Electricity 3 Active
US11139282B2 Semiconductor package structure and method for manufacturing the same Electricity 2 Active
US10515888B2 Semiconductor device and method for manufacturing the same Electricity 2 Active
US6382861B1 Cleaning device for cleaning dirt produced from manufacturing equipment Performing Operations; Transporting 1 Expired
US10515869B1 Semiconductor package structure having a multi-thermal interface material structure Electricity 1 Active
US11508696B2 Semiconductor device Electricity 1 Active
US11476184B2 Semiconductor device and method for manufacturing the same Electricity 1 Active
US11978714B2 Encapsulated package including device dies connected via interconnect die Electricity 0 Active
US9406650B2 Methods of packaging semiconductor devices and packaged semiconductor devices Electricity 0 Active
US12322729B2 Semiconductor device Electricity 0 Active
US11532585B2 Package containing device dies and interconnect die and redistribution lines Electricity 0 Active
US12062590B2 Method for manufacturing semiconductor package structure Electricity 0 Active
US9806062B2 Methods of packaging semiconductor devices and packaged semiconductor devices Electricity 0 Active
US12334464B2 Encapsulated package including device dies connected via interconnect die Electricity 0 Active
US12080638B2 Semiconductor device and method for manufacturing the same Electricity 0 Active
US9093489B2 Selective curing method of adhesive on substrate Emerging Cross-Sectional Technologies 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.