High aspect ratio vias filled with liquid metal fill
US12336112B2 · kind B2 · utility
0Cited by
12References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2022 |
| Grant date | Jun 17, 2025 |
| Priority date | — |
| Expiry date | Apr 11, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49993
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A substrate includes a substrate body made of a material such as glass, and at least one electrical via that extends at least into or through the substrate body. The via is metalized with a molten metal that enters the via under capillary action and solidifies to establish electrical conductivity through the via. The melting temperature of the metal is less than the transition temperature and melting temperature of the substrate body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.