Christopher David Bohn
3Patents
0h-index
16Co-inventors
28Inventor score
Filing activity: Dec 14, 2020 → Oct 10, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11823864B1 | Embedded high-Z marker material and process for alignment of multilevel ebeam lithography | Electricity | 0 | Active |
| US12336112B2 | High aspect ratio vias filled with liquid metal fill | Emerging Cross-Sectional Technologies | 0 | Active |
| US12255047B1 | Embedded high-z marker material and process for alignment of multilevel ebeam lithography | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.