Temperature equalization component and electronic device
US12336146B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 29, 2022 |
| Grant date | Jun 17, 2025 |
| Priority date | — |
| Expiry date | Oct 2, 2043 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/201
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A temperature equalization component and an electronic device are disclosed. The temperature equalization component may include a housing and a capillary structure. The housing may include a cavity, and the capillary structure is located in the cavity and is disposed on a side of the housing that faces a heating element. The housing is provided with a first protrusion part and/or a first depression part, and the temperature equalization component is in direct contact with the heating element by using the first protrusion part and/or the first depression part, thereby improving heat transfer efficiency, reducing a probability that heat accumulates around the heating element, and improving a heat dissipation effect of the temperature equalization component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.