Component cooler for a computing device

US12336147B2 · kind B2 · utility

Assignee

• Advanced Micro Devices, Inc. · US

Inventors

• Christopher M. Helberg · Austin, US
• Christopher M. Jaggers · Austin, US
• Robert E. Radke · Austin, US
• Mustansir M. Pratapgarhwala · Austin, US
• Michael J. Austin · Austin, US
• Sukesh Shenoy · Austin, US

Key dates

• Filing date: Sep 29, 2022
• Grant date: Jun 17, 2025
• Expiry date: Feb 28, 2043

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L23/38
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An apparatus for component cooling includes a first heat transfer element configured to be thermally coupled to a heat-generating electronic component, and a second heat transfer element. The apparatus further includes a plurality of heat transfer paths thermally coupled between the first heat transfer element and the second heat transfer element. Each of the plurality of heat transfer paths configured to provide a separate heat conduction path from the first heat transfer element to the second heat transfer element. The apparatus further includes a manifold including a first fluid passage providing a first portion of a heat transfer fluid in thermal contact with the first heat transfer element, and a second fluid passage providing a second portion of the heat transfer fluid in thermal contact with the second heat transfer element.