Patent · US Active

In-plane inductors in IC packages

US12336197B2 · kind B2 · utility

0Cited by

1References

19Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Brandon C. Marin · Chandler, US
Tarek A. Ibrahim · Mesa, US
Prithwish Chatterjee · Tempe, US
Haifa Hariri · Phoenix, US
Yikang Deng · New York, US
Sheng Li · Santa Clara, US
Srinivas V. Pietambaram · Gilbert, US

Key dates

Filing date	Feb 28, 2020
Grant date	Jun 17, 2025
Priority date	—
Expiry date	Apr 9, 2043

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10378
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An integrated circuit (IC) package substrate, comprising a magnetic material embedded within a dielectric material. A first surface of the dielectric material is below the magnetic material, and a second surface of the dielectric material, opposite the first surface, is over the magnetic material. A metallization level comprising a first metal feature is embedded within the magnetic material. A second metal feature is at an interface of the magnetic material and the dielectric material. The second metal feature has a first sidewall in contact with the dielectric material and a second sidewall in contact with the magnetic material.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.