Sheng Li
36Patents
5h-index
52Co-inventors
68Inventor score
Filing activity: Jun 30, 2008 → Sep 29, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10234930B2 | Performing power management in a multicore processor | Emerging Cross-Sectional Technologies | 17 | Active |
| US9910481B2 | Performing power management in a multicore processor | Emerging Cross-Sectional Technologies | 6 | Active |
| US10020262B2 | High resolution solder resist material for silicon bridge application | Electricity | 6 | Active |
| US9430396B2 | Updating persistent data in persistent memory-based storage | Physics | 5 | Active |
| US10716372B1 | Umbrella frame bending structure for two-fold inverted umbrella | Human Necessities | 5 | Active |
| US9690716B2 | High performance persistent memory for region-centric consistent and atomic updates | Physics | 4 | Active |
| US9953959B1 | Metal protected fan-out cavity | Electricity | 3 | Active |
| US11088062B2 | Method to enable 30 microns pitch EMIB or below | Electricity | 2 | Active |
| US8399264B2 | Alignment inspection | Electricity | 2 | Active |
| US10664199B2 | Application driven hardware cache management | Physics | 2 | Active |
| US10775873B2 | Performing power management in a multicore processor | Emerging Cross-Sectional Technologies | 1 | Active |
| US11251113B2 | Methods of embedding magnetic structures in substrates | Electricity | 1 | Active |
| US11430740B2 | Microelectronic device with embedded die substrate on interposer | Electricity | 1 | Active |
| US11676891B2 | Method to enable 30 microns pitch EMIB or below | Electricity | 1 | Active |
| US11581271B2 | Methods to pattern TFC and incorporation in the ODI architecture and in any build up layer of organic substrate | Electricity | 1 | Active |
| US11824013B2 | Package substrate with reduced interconnect stress | Electricity | 0 | Active |
| US10672859B2 | Embedded magnetic inductor | Electricity | 0 | Active |
| US10108556B2 | Updating persistent data in persistent memory-based storage | Physics | 0 | Active |
| US12336197B2 | In-plane inductors in IC packages | Electricity | 0 | Active |
| US11196165B2 | Low z-height, ultra-low dielectric constant air cavity based and multi-core/highly asymmetric antenna substrate architectures for electrical performance improvements in 5G mm-wave applications | Electricity | 0 | Active |
| US10617185B2 | Umbrella with umbrella cloth connected using retaining blocks | Mechanical Engineering; Lighting; Heating | 0 | Active |
| US7919408B2 | Methods for fabricating fine line/space (FLS) routing in high density interconnect (HDI) substrates | Electricity | 0 | Active |
| US10692965B2 | 3D conductive ink printing method and inductor formed thereof | Electricity | 0 | Active |
| US11651885B2 | Magnetic core inductors | Electricity | 0 | Active |
| US11894311B2 | Microelectronic device with embedded die substrate on interposer | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.