Dielectric film-forming composition
US12338309B2 · kind B2 · utility
0Cited by
30References
18Claims
0Family size
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Key dates
| Filing date | Mar 4, 2024 |
| Grant date | Jun 24, 2025 |
| Priority date | — |
| Expiry date | Mar 4, 2044 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/38
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
This disclosure relates to a dielectric film-forming composition that includes at least one cyclized polydiene resin, and one or both of at least one reactive functional compound and at least one catalyst.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.