Patent · US Active

Shaped showerhead for edge plasma modulation

US12338530B2 · kind B2 · utility

0Cited by

6References

16Claims

0Family size

Assignee

Applied Materials, Inc. · US

Inventors

Saketh Pemmasani · Hyderabad, IN
Daemian Raj Benjamin Raj · Fremont, US
Xiaopu Li · San Jose, US
Akshay Dhanakshirur · Gokul, IN
Mayur Govind Kulkarni · Sunnyvale, US
Madhu Santosh Kumar Mutyala · Santa Clara, US
Deenesh Padhi · Sunnyvale, US
Hang Yu · Woodland, US

Key dates

Filing date	Jul 9, 2021
Grant date	Jun 24, 2025
Priority date	—
Expiry date	Jul 26, 2041

Classification

Technology area (CPC H)Electricity
CPC primaryH01J2237/327
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

Exemplary semiconductor processing chambers may include a chamber body. The chambers may include a substrate support disposed within the chamber body. The substrate support may define a substrate support surface. The chambers may include a showerhead positioned supported atop the chamber body. The substrate support and a bottom surface of the showerhead may at least partially define a processing region within the semiconductor processing chamber. The showerhead may define a plurality of apertures through the showerhead. The bottom surface of the showerhead may define an annular groove or ridge that is positioned directly above at least a portion of the substrate support.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.