Training method for semiconductor process prediction model, semiconductor process prediction device, and semiconductor process prediction method
US12339632B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 15, 2022 |
| Grant date | Jun 24, 2025 |
| Priority date | — |
| Expiry date | Mar 29, 2043 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P90/30
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A training method of a semiconductor process prediction model, a semiconductor process prediction device, and a semiconductor process prediction method are provided. The training method of the semiconductor process prediction model includes the following steps. The semiconductor process was performed on several samples. A plurality of process data of the samples are obtained. A plurality of electrical measurement data of the samples are obtained. Some of the samples having physical defects are filtered out according to the process data. The semiconductor process prediction model is trained according to the process data and the electrical measurement data of the filtered samples.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.