Resin shaping device
US12341036B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jan 20, 2023 |
| Grant date | Jun 24, 2025 |
| Priority date | — |
| Expiry date | Jun 16, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0409
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A resin shaping device configured to cure a resin placed in a mold in a state in which the mold is pressed against a substrate, the resin shaping device comprising: a substrate holding unit configured to hold the substrate in an orientation such that a forming face for forming a resin part on the substrate faces vertically downward; a head configured to hold the mold from vertically below; a head drive unit configured to cause the head to face a position for formation of a resin part on the substrate, and then cause vertically upward movement of the head so that the head approaches the substrate holding unit and presses the mold from vertically below the substrate; and a resin curing unit configured to cure the resin placed in the mold in a state in which the mold is pressed against the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.