Micro socket electrical couplings for dies

US12341281B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Srikant Nekkanty · Chandler, US
• Debendra Mallik · Chandler, US
• Joe Walczyk · Tigard, US
• Saikumar Jayaraman · Chandler, US
• Feroz Mohammad · Chandler, US

Key dates

• Filing date: Dec 23, 2020
• Grant date: Jun 24, 2025
• Expiry date: Oct 22, 2043

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L25/167
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Embodiments described herein may be related to apparatuses, processes, and techniques related to micro socket arrays with fine pitch contacts to electrically couple dies, in particular photonics dies, within multichip photonics packages. In embodiments, micro socket arrays may be used in conjunction with multichip module packaging that include silicon photonic engines and optical fiber modules on the same package. In embodiments, these packages may also use a system on chip (SOC), as well as fine pitch die to die connections, for example an EMIB, that may be used to connect a PIC with an SOC. Other embodiments may be described and/or claimed.