Patent · US Active

Package comprising an acoustic device and a polymer cap layer

US12341488B2 · kind B2 · utility

0Cited by

11References

30Claims

0Family size

Assignee

QUALCOMM Incorporated · US

Inventors

Sebastian Brunner · Graz, AT
Changhan Hobie Yun · San Diego, US
Stefan Leopold Hatzl
Manuel Hofer · Wolfsberg, AT
Horst Droescher · Freidorf an der Laßnitz, AT
Christian Hoffmann · Leonberg, DE

Key dates

Filing date	Sep 20, 2022
Grant date	Jun 24, 2025
Priority date	—
Expiry date	Jul 18, 2043

Classification

Technology area (CPC H)Electricity
CPC primaryH03H9/1092
WIPO fieldBasic communication processes
WIPO sectorElectrical engineering

Abstract

A package comprising an acoustic device, a polymer frame coupled to the acoustic device, a plurality of frame interconnects located in the polymer frame, where the plurality of frame interconnects are coupled to the acoustic device, a polymer cap layer coupled to the acoustic device though the polymer frame, where the polymer cap layer is configured as a cap for the acoustic device, a plurality of cap interconnects located in the polymer cap layer, where the plurality of cap interconnects are coupled to the plurality of frame interconnects, and a cavity located between the acoustic device and the polymer cap layer. The acoustic device includes a substrate and an acoustic element coupled to the substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.