Compartmentalized shielding of a module utilizing self-shielded sub-modules
US12342518B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 23, 2023 |
| Grant date | Jun 24, 2025 |
| Priority date | — |
| Expiry date | Oct 26, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/54
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The disclosure relates to a shielded electronic module which includes a module shielding structure and an electronic module with an interposer, a shielded electronic submodule over the interposer, and a module mold compound over the interposer and encapsulating sides of the shielded electronic submodule. Herein, the shielded electronic submodule includes an electronic submodule and a submodule side shielding structure, which covers sides of the electronic submodule to provide the sides of the shielded electronic submodule. A top surface of the electronic module is a combination of a top surface of the module mold compound and a top surface of the shielded electronic submodule, which is not covered by the module mold compound. The module shielding structure directly and continuously covers the top surface and sides of the electronic module, such that the submodule side shielding structure is electrically connected to the module shielding structure to individually shield the electronic submodule.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.