Plating apparatus
US12344954B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 7, 2022 |
| Grant date | Jul 1, 2025 |
| Priority date | — |
| Expiry date | Feb 7, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In a plating apparatus including a shielding member, an ionically resistive element is disposed to be close to a surface to be plated of a substrate to improve uniformity of a distribution of plating film-thickness.A plating apparatus includes: a plating tank 410 configured to house a plating solution; a substrate holder 440 configured to hold a substrate Wf with a surface to be plated Wf-a facing downward; an anode 430 disposed in the plating tank 410; an ionically resistive element 450 disposed between the substrate Wf and the anode 430 and including an opposed surface 450-a opposed to the surface to be plated Wf-a, the opposed surface 450-a including a first opposed surface 450-a1 and a second opposed surface 450-a2 apart from the surface to be plated Wf-a more than the first opposed surface 450-a1; and a shielding member 481 disposed in a depressed region β of the ionically resistive element 450, the depressed region β being formed by the second opposed surface 450-a2. The shielding member 481 is for shielding an electric field.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.