Techniques for controlling overburden planarization
US12345887B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2022 |
| Grant date | Jul 1, 2025 |
| Priority date | — |
| Expiry date | Aug 9, 2042 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24364
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method of planarizing an overcoat layer on a surface-relief grating includes dispensing a layer of a resin material that is curable by heat or electromagnetic radiation on a surface-relief grating that includes a plurality of grating grooves, pressing the layer of the resin material using a planar imprint stamp, curing the resin material in the layer of the resin material, and detaching the planar imprint stamp from the layer of the resin material. In one example, a thickness of the overcoat layer on top of grating ridges of the surface-relief grating is equal to or less than 20 nm, and a surface peak-to-valley height of a top surface of the overcoat layer is equal to or less than 5 nm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.