Integrated circuit package with flipped high bandwidth memory device
US12347780B2 · kind B2 · utility
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Key dates
| Filing date | Sep 15, 2021 |
| Grant date | Jul 1, 2025 |
| Priority date | — |
| Expiry date | Nov 2, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B80/00
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An example microelectronic assembly includes a substrate, a bridge die over the substrate, and a die stack between the substrate and the bridge die, the die stack including a logic die and at least one memory die, where the logic die is between the at least one memory die and the bridge die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.