Multi-layered resonator circuit structure and multi-layered filter circuit structure
US12347912B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 14, 2023 |
| Grant date | Jul 1, 2025 |
| Priority date | — |
| Expiry date | Dec 13, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P3/088
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A multi-layered resonator circuit structure and a multi-layered filter circuit structure. The multi-layered resonator circuit structure includes a multi-layered substrate, a plurality of resonators and a plurality of conductive components. The multi-layered substrate has a top surface, a bottom surface, and a ground layer. The top surface and the bottom surface face away from each other. The ground layer is located between the top surface and the bottom surface. A part of the plurality of resonators is/are disposed on the top surface. Another part of the plurality of resonators is/are disposed on the bottom surface. The plurality of conductive components is located in the multi-layered substrate. The plurality of resonators is electrically connected to the ground layer, respectively, via the plurality of conductive components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.