Patent · US Active

Co-planar interconnection mechanisms for circuit boards

US12349276B2 · kind B2 · utility

0Cited by

0References

22Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Mooi Ling Chang · Bayan Lepas, MY
Tin Poay Chuah · Bukit Mertajam, MY
Eng Huat Goh · Air Itam, MY
Min Suet Lim · Kampung Bukit Kechil, MY
Twan Sing Loo · Kampung Bukit Kechil, MY

Key dates

Filing date	Feb 14, 2022
Grant date	Jul 1, 2025
Priority date	—
Expiry date	Nov 3, 2043

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/209
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

In one embodiment, a system includes a first circuit defining recesses along an edge of the first circuit board, and a second circuit board defining fins extending from at least one outer edge of the second circuit board. The fins of the second circuit board are positioned within the recesses of the second circuit board to connect the circuit boards in a co-planar manner. The fins and recesses may be shaped to provide an interlocking connection of the first and second circuit boards in the co-planar direction.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.