Patent · US Active

Low force liquid metal interconnect solutions

US12349303B2 · kind B2 · utility

0Cited by

1References

20Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Karumbu Meyyappan · Portland, US
Kyle Arrington · Gilbert, US
David Craig · Albany, US
Pooya Tadayon · Portland, US

Key dates

Filing date	Feb 22, 2023
Grant date	Jul 1, 2025
Priority date	—
Expiry date	Feb 22, 2043

Classification

Technology area (CPC H)Electricity
CPC primaryH01L23/3675
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate having a first surface and a second surface opposite from the first surface, and a die on the first surface of the package substrate. In an embodiment, the electronic package further comprises a socket interface on the second surface of the package substrate. In an embodiment, the socket interface comprises a first layer, wherein the first layer comprises a plurality of wells, a liquid metal within the plurality of wells, and a second layer over the plurality of wells.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.