David Craig
16Patents
4h-index
24Co-inventors
60Inventor score
Filing activity: Aug 27, 2003 → Feb 22, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7576439B2 | Electrically connecting substrate with electrical device | Electricity | 108 | Active |
| US7476608B2 | Electrically connecting substrate with electrical device | Electricity | 107 | Expired |
| US6917099B2 | Die carrier with fluid chamber | Electricity | 6 | Expired |
| US7300812B2 | Micro electrical mechanical system | Electricity | 5 | Expired |
| US11527501B1 | Sacrificial redistribution layer in microelectronic assemblies having direct bonding | Electricity | 4 | Active |
| US7307773B2 | Micro-optoelectromechanical system packages for a light modulator and methods of making the same | Electricity | 4 | Expired |
| US7019886B2 | Light modulator | Physics | 2 | Expired |
| US7541209B2 | Method of forming a device package having edge interconnect pad | Emerging Cross-Sectional Technologies | 1 | Active |
| US9977054B2 | Etching for probe wire tips for microelectronic device test | Physics | 1 | Active |
| US11622466B2 | Low force liquid metal interconnect solutions | Electricity | 1 | Active |
| US11340258B2 | Probe pins with etched tips for electrical die test | Physics | 0 | Active |
| US10598696B2 | Probe pins with etched tips for electrical die test | Physics | 0 | Active |
| US11749628B2 | Sacrificial redistribution layer in microelectronic assemblies having direct bonding | Electricity | 0 | Active |
| US7262498B2 | Assembly with a ring and bonding pads formed of a same material on a substrate | Electricity | 0 | Expired |
| US12349303B2 | Low force liquid metal interconnect solutions | Electricity | 0 | Active |
| US8497577B2 | Micro electrical mechanical system | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.