Transfer printing for RF applications
US12349461B2 · kind B2 · utility
0Cited by
2References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 24, 2022 |
| Grant date | Jul 1, 2025 |
| Priority date | — |
| Expiry date | Jul 30, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03F2200/451
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A semiconductor structure for RF applications comprises: a first μTP GaN transistor on an SOI wafer or die; and a first resistor connected to the gate of said first transistor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.