Semiconductor light source device of optical integrated packaging
US12349524B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Jun 2, 2021 |
| Grant date | Jul 1, 2025 |
| Priority date | — |
| Expiry date | Aug 11, 2041 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/882
Abstract
The present application relates to the technical field of optical integrated devices, and specifically discloses a semiconductor light source device of optical integrated packaging with high light extraction efficiency and low device heat generation. The semiconductor light source device of optical integrated packaging comprises a substrate, an optical lens, a LED chip and a light transmitting glue layer, the substrate is provided with a circuit, and the optical lens is fixedly connected with the substrate; a light source cavity is provided between the optical lens and the substrate; the LED chip and the light transmitting glue layer are respectively accommodated in the light source cavity; the LED chip is arranged on top of the circuit and electrically connected with the circuit; the light transmitting glue layer is at least arranged on an upper surface of the LED chip; the light transmitting glue layer is used to reduce Fresnel loss when the light of the LED chip is taken out; an outer surface of the light transmitting glue layer is a convex surface, and the convex surface is used to reduce a total reflection loss of a light emitted by the LED chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.