Plating apparatus and plating method
US12351929B2 · kind B2 · utility
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5References
3Claims
0Family size
Assignee
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Key dates
| Filing date | Mar 10, 2021 |
| Grant date | Jul 8, 2025 |
| Priority date | — |
| Expiry date | Oct 18, 2042 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/12
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
To improve uniformity of a plating film-thickness formed on a substrate.A plating module 400 includes a plating tank 410 for housing a plating solution, a substrate holder 440 for holding a substrate Wf, an anode 430 housed within the plating tank 410, an anode mask 460 arranged between the substrate Wf held by the substrate holder 440 and the anode 430 and provided with an opening 466 in a center, and an ionically resistive element 450 arranged at an interval from the anode mask 460 between the substrate Wf held by the substrate holder 440 and the anode mask 460 and provided with a plurality of holes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.