Distribution system for a process fluid for chemical and/or electrolytic surface treatment of a substrate
US12351935B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 2, 2021 |
| Grant date | Jul 8, 2025 |
| Priority date | — |
| Expiry date | Dec 2, 2041 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/10
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The disclosure relates to a distribution system for a process fluid for a chemical and/or electrolytic surface treatment of a substrate, comprising: a distribution body, and a substrate holder, wherein the substrate holder has a substrate holder length (L) and a substrate holder width (W) and is configured to hold the substrate to be treated, wherein the distribution body comprises several openings for a process fluid and/or an electric current, wherein the distribution body and the substrate holder are moveable relative to each other, wherein the distribution body has a distribution body length (l) and a distribution body width (w), and wherein the distribution body length (l) is smaller than the substrate holder length (L).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.