In-situ focus ring coating
US12354842B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 19, 2023 |
| Grant date | Jul 8, 2025 |
| Priority date | — |
| Expiry date | Oct 5, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/334
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of etching a substrate includes loading the substrate into a plasma etch chamber, the plasma etch chamber including a focus ring surrounding the substrate, the focus ring including a bulk material and a surface layer, the surface layer including a refractory metal; flowing a process gas including fluorine and carbon into the plasma etch chamber; coating a carbide layer over the surface layer of the focus ring, the coating including exposing the focus ring to a plasma generated from the process gas in the plasma etch chamber, the carbide layer including a carbide of the refractory metal; and etching the substrate, the etching including exposing the substrate to the plasma.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.