Film formation apparatus
US12354854B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2022 |
| Grant date | Jul 8, 2025 |
| Priority date | — |
| Expiry date | Nov 6, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68771
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
According to one embodiment, a film formation apparatus that suppresses effects of pre-processing and enables stable film formation is provided. A film formation apparatus of the present disclosure includes a chamber that can be made vacuum, a transporter that is provided inside the chamber and that circulates and transports a workpiece in a trajectory of a circle, a film formation unit that forms film by sputtering on the workpiece circulated and transported by the transporter, a load-lock room that loads the workpiece into and out of the chamber relative to air space while keeping an interior of the chamber vacuum, and a pre-processing unit that is provided in the chamber at a position adjacent to the load-lock room and that performs pre-processing to the workpiece loaded in from the load-lock room in a state distant from the transporter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.