Process kits and related methods for processing chambers to facilitate deposition process adjustability

US12354855B2 · kind B2 · utility

Assignee

• Applied Materials, Inc. · US

Inventors

• Zhepeng CONG · San Jose, US
• Ala Moradian · Sunnyvale, US
• Tao SHENG · King City, CA
• Nimrod SMITH · Cupertino, US
• Ashur J. ATANOS · San Jose, US
• Vinh N. TRAN · San Jose, US

Key dates

• Filing date: Jul 22, 2022
• Grant date: Jul 8, 2025
• Expiry date: Jul 12, 2043

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/68735
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

The present disclosure relates to flow guides, process kits, and related methods for processing chambers to facilitate deposition process adjustability. In one implementation, a flow guide applicable for use in semiconductor manufacturing, includes a plate having a first face and a second face opposing the first face. The flow guide includes a first fin set extending from the second face, and a second fin set extending from the second face. The second fin set is spaced from the first fin set to define a flow path between the first fin set and the second fin set. The flow path has a serpentine pattern between the first fin set and the second fin set.