Patent · US Active

Omni directional interconnect with magnetic fillers in mold matrix

US12354883B2 · kind B2 · utility

0Cited by

0References

18Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Bohan Shan · Chandler, US
Dingying Xu · Chandler, US
Kristof Darmawikarta · Chandler, US
Srinivas V. Pietambaram · Gilbert, US
Hongxia Feng · Chandler, US
Gang Duan · Beijing, CN
Jung Kyu Han · Chandler, US
Xiaoying Guo · Phoenix, US
Jeremy Ecton · Gilbert, US
Santosh Tripathi · Portland, US
Bai Nie · Chandler, US
Haobo Chen · Chandler, US
Kyle Arrington · Gilbert, US
Yue Deng · Plano, US
Wei-Hsin Wei · Zhubei City, TW

Key dates

Filing date	Sep 24, 2021
Grant date	Jul 8, 2025
Priority date	—
Expiry date	Nov 9, 2043

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2221/68372
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Various embodiments disclosed relate to methods of making omni-directional semiconductor interconnect bridges. The present disclosure includes semiconductor assemblies including a mold layer having mold material, a first filler material dispersed in the mold material, and a second filler material dispersed in the mold material, wherein the second filler material is heterogeneously dispersed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.