Manufacturing method of package circuit
US12354919B2 · kind B2 · utility
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1References
5Claims
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Assignee
Inventors
Key dates
| Filing date | Nov 4, 2021 |
| Grant date | Jul 8, 2025 |
| Priority date | — |
| Expiry date | Sep 23, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/117
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The embodiments of the disclosure provide a manufacturing method of a package circuit, including the following steps. A circuit structure including a plurality of conductive pads is formed. A liquid crystal layer is formed on the circuit structure. An inspection step is performed, and the inspection step includes determining the conductivity of the conductive pads according to the result of the rotation of a liquid crystal layer oriented with an electric field. In addition, the liquid crystal layer is removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.