Terahertz plasmonics for testing very large-scale integrated circuits under bias

US12360159B2 · kind B2 · utility

Assignee

• The Government of the United States, as represented by the Secretary of the Army · US

Inventors

• Greg Rupper · Silver Spring, US
• John Suarez · Brooklyn, US
• Sergey Rudin · Dayton, US
• Meredith Reed · Perry Hall, US
• Michael Shur · Latham, US

Key dates

• Filing date: Jun 9, 2023
• Grant date: Jul 15, 2025
• Expiry date: Oct 16, 2043

Classification

• Technology area (CPC G): Physics
• CPC primary: G01R31/318533
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Various embodiments are described that relate to failure determination for an integrated circuit. An integrated circuit can be tested to determine if the integrated circuit is functioning properly. The integrated circuit can be subjected to a specific radiation such that the integrated circuit produces a response. This response can be compared against an expected response to determine if the response matches the expected response. If the response does not match the expected response, then the integrated circuit fails the test. If the response matches the expected response, then the integrated circuit passes the test.