PAG-free positive chemically amplified resist composition and methods of using the same
US12360453B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 17, 2020 |
| Grant date | Jul 15, 2025 |
| Priority date | — |
| Expiry date | Aug 23, 2042 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/2002
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A resist composition which has as components a phenolic resin component, a photoactive 2,1,5-diazonaphthoquinonesulfonate component (PAC), a solvent component and that does not contain a photo acid generator (PAG). The PAC is a free PAC, a coupled PAC (PACb) or a combination thereof that includes a substituted or unsubstituted 2,1,5-DNQ material or compound onto which a substituted or unsubstituted 2,1,5-DNQ material is appended that, when UV exposed, do not form sulfonic acid. The phenolic resin component is a Novolak derivative in which some or all the free hydroxy groups are protected with an acid cleavable acetal moiety which can include a PACb moiety. A method whereby this composition is used in either thick or thin film photoresist device manufacturing methodologies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.