Apparatus for treating substrate
US12362147B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 16, 2022 |
| Grant date | Jul 15, 2025 |
| Priority date | — |
| Expiry date | Jun 9, 2043 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3244
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An exemplary embodiment of the present invention provided an apparatus for treating a substrate. The apparatus for treating the substrate includes a process chamber having a treating space therein, a support unit for supporting the substrate in the treating space, gas supply unit for supplying treating gas to the treating space, and a microwave application unit for applying microwaves to the treating gas to generate plasma, wherein the microwave application unit includes a transmission plate disposed above the support unit to radiate the microwaves to the treating space, a first waveguide disposed above the transmission plate, and a first power supply for applying the microwaves to the first waveguide, wherein the first waveguide is provided in a ring shape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.