Fill-in planarization system and method
US12362237B1 · kind B1 · utility
0Cited by
25References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 5, 2024 |
| Grant date | Jul 15, 2025 |
| Priority date | — |
| Expiry date | Apr 5, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/304
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Systems and methods for laser-based surface processing operations on a wide bandgap semiconductor wafer, such as a silicon carbide semiconductor wafer, are provided. In one example, a method includes providing a semiconductor workpiece having a surface, the semiconductor workpiece including silicon carbide. The method includes providing a filler material on at least a portion of the surface. The method includes, subsequent to providing the filler material, performing a surface processing operation on the surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.