Protruding SN substrate features for epoxy flow control

US12362250B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Edvin Cetegen · Chandler, US
• Jacob VEHONSKY · Gilbert, US
• Nicholas S. Haehn · Scottsdale, US
• Thomas HEATON · Mesa, US
• Steve Cho · Chandler, US
• Rahul Jain · Chandler, US
• Tarek A. Ibrahim · Mesa, US
• Antariksh Rao Pratap SINGH · Gilbert, US
• Nicholas Neal · Gilbert, US
• Sergio Antonio Chan Arguedas · Chandler, US
• Vipul V. Mehta · Chandler, US

Key dates

• Filing date: Apr 10, 2024
• Grant date: Jul 15, 2025
• Expiry date: Apr 10, 2044

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/18161
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Embodiments disclosed herein include electronic packages with underfill flow control features. In an embodiment, an electronic package comprises a package substrate and a plurality of interconnects on the package substrate. In an embodiment, a die is coupled to the package substrate by the plurality of interconnects and a flow control feature is adjacent on the package substrate. In an embodiment, the flow control feature is electrically isolated from circuitry of the electronic package. In an embodiment, the electronic package further comprises an underfill surrounding the plurality of interconnects and in contact with the flow control feature.