Micromechanical component for a sensor or microphone device

US12365581B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Heribert Weber · Leverkusen, DE
• Andreas Scheurle · Leonberg, DE
• Joachim Fritz · Rötteln, DE
• Peter Schmollngruber · Aidlingen, DE
• Sophielouise Mach · Reutlingen, DE
• Thomas Friedrich · Bietigheim-Bissingen, DE

Key dates

• Filing date: May 10, 2021
• Grant date: Jul 22, 2025
• Expiry date: Dec 26, 2042

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81B2203/0315
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A micromechanical component for a sensor or microphone device, including a substrate, a frame structure, which is situated on the substrate surface and/or at least one intermediate layer, and a diaphragm, which spans an inner volume, which is at least partially framed by the frame structure. The micromechanical component includes a bending beam structure, which is situated in the inner volume and includes at least one anchoring area, which is attached to the frame structure, to the substrate surface and/or to the at least one intermediate layer, and at least one self-supporting area, which is connected via at least one coupling structure to the diaphragm inner side of the diaphragm in such a way that the at least one self-supporting area is bendable by way of a warping of the diaphragm.