Jet impingement cooling for high power semiconductor devices
US12368088B2 · kind B2 · utility
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2References
20Claims
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Assignee
Inventor
Key dates
| Filing date | May 29, 2024 |
| Grant date | Jul 22, 2025 |
| Priority date | — |
| Expiry date | May 29, 2044 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/40
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A jet impingement cooling assembly for semiconductor devices includes a heat exchange base having an inlet chamber and an outlet chamber. An inlet connection may be in fluid connection with the inlet chamber, while an outlet connection may be in fluid connection with the outlet chamber. A jet plate may be coupled to the inlet chamber, and a jet pedestal may be formed on the jet plate and having a raised surface with a jet nozzle formed therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.